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| MCC Features * * * Extremely Low VF Extremely thin package Low stored charge omponents 21201 Itasca Street Chatsworth !"# $ % !"# MC551-30 0.5 Amp Surface Mount Schottky Barrier Diode Mechanical Data * * * * * Case:Molded plastic, JEDEC SOD-323 Terminal : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Indicated by cathode band Mounting Position : Any Weight : 0.000159 ounce, 0.0045 gram 30 Volts SOD323 Maximum Ratings * * Operating Junction Temperature: -40C to +125C Storage Temperature: -40C to +125C MCC Catalog Number M C551-30 Device Marking Repetitive Peak Reverse Voltage 30V Continuous Reverse Voltage 20V D F DIMENSIONS INCHES DIM A B C D E F MIN .091 .063 .010 .045 .004 .031 MAX .106 .071 .017 .053 .012 .045 MIN 2.30 1.60 0.25 1.15 0.10 0.80 MM MAX 2.70 1.80 0.43 1.35 0.30 1.15 NOTE A B K C E K Electrical Characteristics @ 25C Unless Otherwise Specified Mean Rectifying Current Peak Forward Surge Current Maximum Forward Voltage Drop Per Element Maximum DC Reverse Current At Rated DC Blocking Voltage IO IFSM 0.5A TA = 25C 1000mA 8.3ms, half sine Suggested Solder Pad Layout VF 0.47V 0.36V 30 TA = 25C IFM =500mA I FM =100mA TA = 25C VR=10V 0.027" 0.074" IR 0.022" www.mccsemi.com MC551-30 RATING AND CHARACTERISTIC CURVES MCC 10m 125 C O 1000 FORWARD CURRENT : (mA) REVERSE CURRENT : (A) 1m 75 C O 100 100 10 25 C O o 5C C 25 o C 10 12 75 o 25 o C 1 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.1 10 20 40 FORWARD VOLTAGE : (V) REVERSE VOLTAGE : (V) Fig. 1 Forward characteristics Fig. 2 Reverse characteristics 100 80 60 40 20 0 0 CAPACITANCE BETWEEN TERMINALS : (pF) Io CURRENT (%) 10 25 50 75 100 1 0 5 101 52 02 53 03 5 AMBIENT TEMPERATURE : Ta REVERSE VOLTAGE : V Fig. 4 Derating curve (mounting on glass epoxy PCBs) Fig. 3 Capacitance between terminals characteristics www.mccsemi.com |
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